INNOVATECH ASSOCIATES ROCKY MOUNTAINS
Innovatech is one of the premier technology focused manufacturer’s representatives in the Rocky Mountain region. Our company is measured by the quality of our supplier partners and the pedigree of our people. Our partners consist of industry leaders in the high technology and semiconductor industry; For active semiconductors : Lattice Semiconductor, Maxim Integrated, , Nanya Technology Corp, and Toshiba. And for our IP&E portfolio : TDK (incl Epcos), TDK-Lambda, TE Connectivity and Visionox. Our sales organization consists of 6 experienced sales professionals, all with technical degrees, coupled with 2 individuals with 20+ years of industry related operational experience. We offer sales coverage across the five Rocky Mountain states of Colorado, Utah, Idaho, Montana and Wyoming with regional sales offices in Golden, CO, and Salt Lake City, UT.
We look forward to serving you!
Innovatech, through our best-in-class partnerships, offers our valued customers access to a broad and extremely powerful technology portfolio. Please follow the below link for access to some of the newest and most exciting products.
System designers can speed time to market for wearable and healthcare products with the MAX30102 pulse oximeter and heart rate integrated sensor module from Maxim Integrated Products, Inc. (NASDAQ: MXIM). The integrated pulse oximetry and heart rate monitor module is an ultra-low power solution providing a complete system to save space and ease the design-in process for mobile and wearable devices.
- For information about MAX30102, visit http://bit.ly/MAX30102
Wearable equipment for vital-sign monitoring is rapidly evolving, and analog integration is at the heart of this. System-on-chip (SoC) and integrated module solutions are rapidly replacing discrete, multicomponent designs. The MAX30102 integrates red and IR LEDs to modulate LED pulses for oxygen saturation (SpO2) and heart rate measurements.
- Ultra-low power: Extends battery life; Operates on a single 1.8V power supply and a separate 5V power supply for the internal LEDs
- Space savings: Maintains a very small solution size without sacrificing optical or electrical performance; Integrates internal LEDs, photodetectors, optical elements, and low-noise electronics with ambient light rejection
- Ease of design: Evaluation platform with the integrated module and an accelerometer provides a solution for customers to quickly evaluate the module
Toshiba Now Shipping Samples of 64-Layer, 512Gb 3D Flash Memory
Expands Lineup with Largest Capacity BiCS FLASH Device, Enabling 1-Terabyte Single Chip
IRVINE, Calif., February 24, 2017 -- Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has added a 512 gigabit (Gb)1 (64 gigabyte), 64-layer device with 3-bit-per-cell triple-level cell (TLC) technology to its industry-leading BiCS FLASH™ product line. This technology will enable a 1-terabyte (TB) chip solution. BiCS FLASH is a three-dimensional (3D) flash memory stacked cell structure2 and is suitable for applications that require high capacity and performance, such as enterprise and consumer solid state drives, including Toshiba’s own SSD portfolio. Sample shipments of the new 512Gb devices have begun, with mass production scheduled for the second half of 2017.
As a 3D flash memory leader, Toshiba continues to refine its BiCS FLASH offerings. The next milestone on its BiCS FLASH development roadmap will feature the industry’s largest capacity3, a 1TB product with a 16-die stacked architecture, in a single package. Plans call for sample shipments to commence in April of this year.
Toshiba’s new 512Gb BiCS FLASH device is based on its cutting-edge, third generation, 64-layer stacking process that realizes a 65 percent larger capacity per unit chip size than the company’s 48-layer, 256Gb (32 gigabyte) device. This increases memory capacity per silicon wafer and leads to a reduction of cost-per-bit.
In addition to the new 512Gb device, Toshiba’s BiCS FLASH lineup also includes a 64-layer 256Gb (32 gigabyte) offering, which is currently in mass production. According to Scott Nelson, senior vice president of TAEC’s memory business unit, “The introduction of our third generation BiCS FLASH coupled with the industry’s largest 1TB chip solution strongly reinforces Toshiba’s flash leadership position. These innovations underline our commitment to developing leading-edge memory solutions, and we will continue to advance our 3D technology to meet the ever-increasing storage market demand.”
In support of this commitment, Toshiba recently announced that construction has begun on a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new memory-focused R&D Center, at Yokkaichi Operations in Mie Prefecture, Japan. Fab 6 will be dedicated to the production of BiCS FLASH.
The Internet of Things Delivered: Flexible, Secure, and Seamless
The Ayla Platform™ is the industry’s only complete end-to-end platform for transforming everyday products into cloud-connected devices quickly, easily and economically. Ayla combines its innovative and highly efficient technology with best-in-class hardware, applications, cloud-based services and digital information services from leading vendors to allow manufacturers to reinvent their products for the smartphone era.
Innovatech Associates Rocky Mountains
2721 Interlocken Drive
Evergreen CO 80439
Phone: 303 974-1031